The course will provide you with the basic concepts of the engineering principles behind semiconductor processing, wafer fabrication and physical principles underlying the operation of basic semiconductor devices. The contents of the course include the fundamentals of p-n diodes, bipolar devices, MOS devices, deposition techniques, diffusion and thermal oxidation, ion implantation, lithography and etching. Contents: Fundamentals of Bipolar Devices. MOS Devices. Crystal growth and wafer preparation. Deposition Techniques. Diffusion and thermal oxidation. Ion implantation. Lithography. Etching.
| AUs | 3.0 AUs |
| Grade Type | |
| Prerequisite | EE2103, EE2003 |
| Not Available To Programme | |
| Not Available To All Programme With | |
| Not Available As BDE/UE To Programme | MAT |
| Not Available As Core To Programme | |
| Not Available As PE To Programme | |
| Mutually Exclusive With | |
| Not Offered As BDE | |
| Not Offered As Unrestricted Elective | |
| Exam |
Available Indexes
| Mon | Tue | Wed | Thu | Fri | |
|---|---|---|---|---|---|
| 930 | 32608 TUT (EE02) 0930-1020 Tue TR+78 | ||||
| 1000 | |||||
| 1030 | |||||
| 1100 | |||||
| 1130 | |||||
| 1200 | |||||
| 1230 | |||||
| 1300 | |||||
| 1330 | 32606 TUT (EE01) 1330-1420 Mon TR+78 | COMMON LEC (EELE) 1330-1520 Tue LT29 | 32607 TUT (EE03) 1330-1420 Thu TR+77 | ||
| 1400 | |||||
| 1430 | |||||
| 1500 |
Other offerings
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