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AY2022/2023 Semester 2
The course will provide you with the basic concepts of the engineering principles behind semiconductor processing, wafer fabrication and physical principles underlying the operation of basic semiconductor devices. The contents of the course include the fundamentals of p-n diodes, bipolar devices, MOS devices, deposition techniques, diffusion and thermal oxidation, ion implantation, lithography and etching. Contents: Fundamentals of Bipolar Devices. MOS Devices. Crystal growth and wafer preparation. Deposition Techniques. Diffusion and thermal oxidation. Ion implantation. Lithography. Etching.
| AUs | 3.0 AUs |
| Categories | Core |
| Not Available As BDE/UE To Programme | MAT |
| Exam |
| Mon | Tue | Wed | Thu | Fri | |
|---|---|---|---|---|---|
| 930 | 32224 LAB (EL01) 0930-1220 Thu S2-B5A-01 Wk11 | ||||
| 1000 | |||||
| 1030 | 32224 TUT (EE01) 1030-1150 Wed TR+66 | ||||
| 1100 | |||||
| 1130 | |||||
| 1200 |