Semiconductor Devices Processing

AY2019/2020 Semester 1

The course will provide you with the basic concepts of the engineering principles behind semiconductor processing, wafer fabrication and physical principles underlying the operation of basic semiconductor devices. The contents of the course include the fundamentals of p-n diodes, bipolar devices, MOS devices, deposition techniques, diffusion and thermal oxidation, ion implantation, lithography and etching. Contents: Fundamentals of Bipolar Devices. MOS Devices. Crystal growth and wafer preparation. Deposition Techniques. Diffusion and thermal oxidation. Ion implantation. Lithography. Etching.