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The course aims to provide undergraduate students a deep training and understanding of fundamentals underlying integrated circuit (IC) packaging, and build-up their capability in IC packaging design, simulation, fabrication and characterization. The course is not only to provide essential fundamental training of IC packaging, but also expose then to challenges and technology trend of IC packaging industry.
IC packaging knowledge and training is important for undergraduate students in the electronic and microelectronic engineering. It is a fundamental course to all undergraduate students who study semiconductor fabrication, IC design, product quality control etc. which is also important for their future career development.
| AUs | 3.0 AUs |
| Grade Type | |
| Prerequisite | Year 4 standing |
| Exam |
| Mon | Tue | Wed | Thu | Fri | |
|---|---|---|---|---|---|
| 930 | |||||
| 1000 | |||||
| 1030 | |||||
| 1100 | |||||
| 1130 | |||||
| 1200 | |||||
| 1230 | |||||
| 1300 | |||||
| 1330 | |||||
| 1400 | |||||
| 1430 | |||||
| 1500 | |||||
| 1530 | |||||
| 1600 | |||||
| 1630 | |||||
| 1700 | |||||
| 1730 | |||||
| 1800 |
EE1102
Physics Foundation For Electrical & Electronic Engineering
EE2005
Electrical Devices & Machines
EE2073
Introduction To Eee Design & Project
EE2101
Circuit Analysis
EE2102
Analog Electronics
EE2103
Semiconductor Fundamentals
EE3011
Modelling & Control
EE3013
Semiconductor Devices & Processing
EE3015
Power Systems & Conversion
| Mon | Tue | Wed | Thu | Fri | |
|---|---|---|---|---|---|
| 1830 | COMMON LEC (A) 1830-2120 Tue "LHS-LT" | ||||
| 1900 | |||||
| 1930 | |||||
| 2000 | |||||
| 2030 | |||||
| 2100 |