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Not offered in the current semester · Last offered AY2025/2026 Semester 1
ModsEE6610

Integrated Circuit Ic Packaging

Last offered — AY2025/2026 Semester 1

The course aims to provide undergraduate students a deep training and understanding of fundamentals underlying integrated circuit (IC) packaging, and build-up their capability in IC packaging design, simulation, fabrication and characterization. The course is not only to provide essential fundamental training of IC packaging, but also expose then to challenges and technology trend of IC packaging industry. IC packaging knowledge and training is important for undergraduate students in the electronic and microelectronic engineering. It is a fundamental course to all undergraduate students who study semiconductor fabrication, IC design, product quality control etc. which is also important for their future career development.

AUs3.0 AUs
Grade Type
PrerequisiteYear 4 standing
Not Available To Programme
Not Available To All Programme With
Not Available As BDE/UE To Programme
Not Available As Core To Programme
Not Available As PE To Programme
Mutually Exclusive With
Not Offered As BDE
Not Offered As Unrestricted Elective
Exam

Total hours per week: 3 hrs