Integrated Circuit Ic Packaging

AY2023/2024 Semester 2

The course aims to provide undergraduate students a deep training and understanding of fundamentals underlying integrated circuit (IC) packaging, and build-up their capability in IC packaging design, simulation, fabrication and characterization. The course is not only to provide essential fundamental training of IC packaging, but also expose then to challenges and technology trend of IC packaging industry. IC packaging knowledge and training is important for undergraduate students in the electronic and microelectronic engineering. It is a fundamental course to all undergraduate students who study semiconductor fabrication, IC design, product quality control etc. which is also important for their future career development.