Advanced Materials Processing

Introduction of semiconductor process, crystal structures and defects; Crystal growth: czochralski method, doping methods and distribution. Gettering, wafer preparation; diffusion equations, diffusion profiles, predeposition, drive-in diffusion, annealing; Oxidation: properties of silicon dioxide, thermal oxidation, kinetics of oxide growth, effects of impurities, oxidation process; Deposition: dielectric film deposition, processes for deposition of silicon dioxide/nitride and polysilicon films; CVD depositions; Sputtering: properties of glow discharges, creation and structure of glow discharges, sputter deposited film growth; Sputtering techniques: RF sputtering, DC magnetrons, bias sputtering, reactive sputtering and ion metal plasma sputtering; Lithography: optical lithography, positive and negative photoresists, lift-off technique, mask making; electron beam lithography, ion beam lithography; Etching: wet chemical etching, etching mechanism, dry etching, dry etching mechanism, plasma etching, reactive ion etching.