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AY2022/2023 Semester 2
Process integration for ULSI devices. CMOS well/isolation/gate module technology. Contact module technology. Interconnect and Metallization. Applications of Thin Films
| AUs | 3.0 AUs |
| Categories | CoreBDE |
| Mutually Exclusive With | MS4503 |
| Exam |
| Mon | Tue | Wed | Thu | Fri | ||
|---|---|---|---|---|---|---|
| 1230 | 15341 TUT (T1) 1230-1320 Wed TR+17 Wk2-13 | 15343 TUT (T1) 1230-1320 Wed TR+17 Wk2-13 | ||||
| 1300 | ||||||
| 1330 | COMMON LEC (LE) 1330-1520 Tue LT11 | 15342 TUT (T2) 1330-1420 Wed TR+17 Wk2-13 | ||||
| 1400 | ||||||
| 1430 | ||||||
| 1500 | ||||||
