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Not offered in the current semester · Last offered AY2025/2026 Semester 1
ModsEE6601

Advanced Wafer Processing

Last offered — AY2025/2026 Semester 1

1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology

AUs3.0 AUs
Grade Type
PrerequisiteYear 4 standing
Not Available To Programme
Not Available To All Programme With
Not Available As BDE/UE To Programme
Not Available As Core To Programme
Not Available As PE To Programme
Mutually Exclusive With
Not Offered As BDE
Not Offered As Unrestricted Elective
Exam

Total hours per week: 3 hrs