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ModsMS4603AY2024/2025 Semester 2
Microelectronics Process Integration
AY2024/2025 Semester 2
Process integration for ULSI devices. CMOS well/isolation/gate module technology. Contact module technology. Interconnect and Metallization. Applications of Thin Films
| AUs | 3.0 AUs |
| Categories | CoreBDE |
| Mutually Exclusive With | MS4503 |
| Exam |
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