Not offered in the current semester · Last offered AY2014/2015 Semester 1
Overview to electronics manufacturing packaging. Interconnection technology, wire-bonding and flip-chip bonding technologies. Plastic package assembly technology and Surface mount assembly technology. Wafer-level fabrication techniques, wafer-level and MEMS packaging applications, Hermetic packaging and assembly. Package technology and trends, Package design types and characteristics, Package design considerations for materials, thermal and reliability performance.
| AUs | 3.0 AUs |
| Grade Type | |
| Prerequisite | M286, M286M, MP2004, MP3104, MP2304, MP3304 |
| Not Available To Programme | ENG, ENG(ME) |
| Not Available To All Programme With | (Admyr 2011-onwards)-Non Direct Entry, (Admyr 2012-onwards), (Admyr 2012-onwards)-Direct Entry |
| Not Available As BDE/UE To Programme | |
| Not Available As Core To Programme | |
| Not Available As PE To Programme | ME 2, ME(DES) 2, ME(MEC) 2, MEEC 2, MEEC(DES) 2, MEEC(MEC) 2 |
| Mutually Exclusive With | |
| Not Offered As BDE | |
| Not Offered As Unrestricted Elective | |
| Exam |
Total hours per week: 3 hrs
Available Indexes
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