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AY2023/2024 Semester 2
1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology
| AUs | 3.0 AUs |
| Categories | Core |
| Exam |
| Mon | Tue | Wed | Thu | Fri | |
|---|---|---|---|---|---|
| 1830 | COMMON LEC (EEE) 1830-2120 Tue "LT27" | ||||
| 1900 | |||||
| 1930 | |||||
| 2000 | |||||
| 2030 | |||||
| 2100 |
